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GE IC200CHS002M: High-Density I/O Carrier Baseplate

Brand: General Electric
Model Number: IC200CHS002M
Type: I/O Carrier Baseplate
Product Origin: USA
Payment: T/T, Western Union, Credit Card
Price: USD 120
Dimensions: 138 mm x 25.4 mm x 120 mm
Weight: 0.25 kg
Warranty: 12 months

  • Product Details

Engineered for GE VersaMax Modular I/O Systems

This baseplate provides mechanical support and backplane connectivity for I/O modules. It serves as the mounting foundation for the GE IC200CHS002M carrier. You will find this baseplate in VersaMax distributed control panels. Unlike smaller carriers, this version offers ten module slots. It accommodates a mix of discrete, analog, and specialty I/O modules.

Technical Specifications & Physical Dimensions

We designed this carrier for high-density I/O applications. The table below presents all verified technical specifications.

Parameter Specification
Physical Dimensions (W x H x D) 278mm x 114mm x 36mm
Total Weight 0.45 kg (450 grams)
Number of Slots 10 module slots
Slot Type VersaMax I/O module interface
Backplane Voltages 5V DC and 3.3V DC
Maximum Module Current 1.5A at 5V, 1.0A at 3.3V
Mounting Type DIN rail (35mm)

Functional Architecture and Bus Distribution

This carrier uses a passive backplane for inter-module communication. It distributes logic power from the bus interface unit to all slots. You can install any VersaMax I/O module into these slots. Moreover, the carrier includes a removable terminal block for field wiring. This component simplifies module replacement without disconnecting field cables. Consequently, the system reduces downtime during maintenance significantly.

Installation and Operational Guidelines

The GE IC200CHS002M requires a bus interface module in the leftmost slot. It draws no separate power supply of its own. You must mount the carrier on standard 35mm DIN rail. Always snap the rail clips into locked position after installation. This practice prevents the carrier from sliding during vibration. Furthermore, the carrier supports hot insertion of most I/O modules. This feature allows module replacement while the system remains powered.

Physical Characteristics and Environmental Limits

This carrier has a rugged, flame-retardant thermoplastic housing. Its lightweight 0.45 kg design allows for easy DIN rail mounting. The layout follows GE standard VersaMax specifications. Therefore, it fits securely inside crowded control cabinets. The carrier requires 110mm clearance above for module removal. In addition, it maintains stable operation between 0°C and 60°C ambient temperature. You can store this unit safely between -40°C and 85°C.

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