GE IC200CHS022B I/O Carrier | VersaMax 8-Slot Mounting

Technical Specifications and Carrier Design

This compact I/O carrier provides mounting and backplane connectivity for GE VersaMax modules. The GE IC200CHS022B holds up to eight I/O modules in a single assembly. You can mount this carrier onto a standard DIN rail or panel surface. Its rugged steel construction prevents flexing during module insertion or removal. The carrier weighs approximately 0.85 kilograms. Its dimensions measure 17 cm in height, 28 cm in width, and 8 cm in depth.

Parameter	Specification
Brand	GE Intelligent Platforms
Model	IC200CHS022B
Category	Compact I/O Carrier / VersaMax Mounting Base
Weight	0.85 kg
Height	17 cm
Width	28 cm
Depth	8 cm
Number of I/O Slots	8 slots (VersaMax modules)
Slot Spacing	3.5 cm per slot
Backplane Type	Passive printed circuit board
Bus Communication	VersaMax Genius or PROFIBUS DP
Power Bus Capacity	10 Amps at 5V DC, 5 Amps at 24V DC
Mounting Method	DIN rail (35 mm) or panel mount (4 screws)
Material	Zinc-coated steel (1.2 mm thickness)
Operating Temperature	0°C to 60°C
Storage Temperature	-40°C to 85°C
Energy Storage	None (passive component)
Component Count	1 chassis, 1 backplane PCB, 8 slot connectors, 1 power connector

Backplane Architecture and Slot Organization

The passive backplane PCB distributes power and signals to all eight slots. Each slot connects to the I/O bus through a 48-pin DIN connector. The GE IC200CHS022B includes a dedicated power input connector on the left side. This connector accepts 24V DC and 5V DC from an external power supply. The backplane uses wide copper traces for low voltage drop. Consequently, all modules receive stable power even at maximum load. Slot 1 typically holds the bus interface unit or power supply. Slots 2 through 8 accommodate digital and analog I/O modules.

Physical Construction and Mounting Options

The zinc-coated steel chassis resists corrosion in industrial environments. Two mounting options support DIN rail or direct panel installation. The GE IC200CHS022B includes card guides for each slot position. These guides align modules correctly during insertion to prevent pin damage. A removable cover plate protects the backplane during shipping or storage. The carrier can support fully populated modules without sagging or distortion. The operating temperature range suits harsh industrial applications.

Installation and Grounding Guidelines

You must mount this carrier on a flat, grounded metal surface for proper shielding. The chassis connects to protective earth through the mounting screws. The GE IC200CHS022B requires at least 5 cm clearance above and below. This clearance allows proper airflow around the installed modules. You should install filler plates in any empty slots for dust protection. The carrier does not include any electronic components or active circuitry. Therefore, it requires no configuration or addressing before use. You must connect the ground terminal to the system protective earth.