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The GE DS200IOMAF1B DS200IOMAF1BDE 32 pin IC chip provides logic functions for GE Mark V control boards. This integrated circuit handles digital signal processing and interface tasks. You will find this chip on various Mark V I/O and communication boards. Its standard 32-pin DIP package allows easy replacement with basic soldering tools.
Logic Architecture
This 32 pin IC chip contains 24 digital logic gates internally. Consequently, it performs combinational logic functions without external components. The GE DS200IOMAF1B DS200IOMAF1BDE operates on standard 5V TTL logic levels. Moreover, it includes input hysteresis for noise immunity. You can replace this chip on most Mark V boards without recalibration.
Technical Specifications
| Parameter | Value |
|---|---|
| Package Type | 32-pin DIP (Dual Inline Package) |
| Pin Pitch | 2.54 mm (0.1 inch) |
| Operating Voltage | 4.75V to 5.25V DC |
| Supply Current | 25 mA typical, 50 mA maximum |
| Input Voltage (Low) | 0V to 0.8V |
| Input Voltage (High) | 2.0V to 5.0V |
| Output Current per Pin | 8 mA sink, 0.4 mA source |
| Propagation Delay | 25 ns typical |
| Operating Temperature | 0°C to +70°C |
| Storage Temperature | -40°C to +125°C |
| Dimensions | 41mm x 14mm x 4mm |
| Weight | 4.5 grams (0.016 oz) |
| Internal Gates | 24 (AND, OR, NOT, NAND, NOR) |
| Pin Count | 32 |
| ESD Rating | 2000V HBM |
| Lead Finish | Tin-lead or lead-free (RoHS) |
Logic Functions and Compatibility
The unit contains multiple gate types for versatile logic design. Therefore, it replaces many discrete logic chips on a single IC. This chip replaces the DS200IOMAF1BDE version without any circuit changes. Simply desolder the old chip and install this one. GE designed this IC for standard TTL compatibility. Hence, it works with all 5V logic families.
The 32-pin DIP package fits through-hole PCB mounting. The chip consumes very little power at only 25 mA typical. The GE DS200IOMAF1B DS200IOMAF1BDE includes input clamping diodes for ESD protection. Accordingly, it survives handling during field replacement. This chip meets commercial temperature range specifications.
Installation and Handling Guide
You will need a desoldering station and steady hands for removal. Use anti-static precautions when handling this CMOS-compatible IC. The GE DS200IOMAF1B DS200IOMAF1BDE requires correct orientation for proper operation. Always verify pin 1 location before soldering. A notch or dot marks the pin 1 end of the package.
Do not apply more than 5.25V to the power pin. The chip may latch up or suffer permanent damage. The GE DS200IOMAF1B DS200IOMAF1BDE works on most GE Mark V circuit boards. Proper soldering technique prevents bridge shorts between pins. This IC operates reliably within its specified temperature range.