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GE IS200BPPBH2B IS200BPPBH2BCA Core I/O Module Processor Board

Brand: General Electric
Model Number: IS200BPPBH2B IS200BPPBH2BCA
Type: Core I/O Module Processor Board
Product Origin: USA
Payment: T/T, Western Union, Credit Card
Price: USD 120
Dimensions: 200 mm x 100 mm x 40 mm
Weight: 0.5 kg
Warranty: 12 months

  • Product Details

The GE IS200BPPBH2B and GE IS200BPPBH2BCA function as core I/O module processor boards for turbine systems. These modules belong to the Mark VI series from General Electric. They manage all input and output processing tasks at the rack level. Consequently, these boards reduce the computational load on the main controller significantly.

Technical Specifications

The table below lists the precise parameters for the GE IS200BPPBH2B and IS200BPPBH2BCA .

Parameter Specification
Manufacturer General Electric (GE)
Full Model Numbers GE IS200BPPBH2B , GE IS200BPPBH2BCA
Product Category Core I/O Module Processor Board
Dimensions (H x W x D) 3.0 cm x 16.0 cm x 26.0 cm
Weight 0.49 kg (1.08 lbs)
Primary Interface Two 64-pin backplane connectors
Analog Inputs 16 differential or 32 single-ended channels
Analog Outputs 8 isolated output channels
Digital I/O 16 configurable digital channels
Component Count Approximately 320 resistors and 160 capacitors
Energy Storage Eight 100 µF electrolytic capacitors
Processor 32-bit RISC microcontroller with FPU
Resolution 16-bit ADC and 14-bit DAC
Operating Temperature -30°C to +65°C

Functional Design and Core Processing

The GE IS200BPPBH2BCA connects directly to the VME backplane of the cabinet. It executes real-time I/O scanning without interrupting the main CPU. Then, this board performs closed-loop control for local applications. Onboard non-volatile memory stores configuration data permanently. Therefore, the IS200BPPBH2B maintains operation even after a power cycle.

Installation and Compatibility Notes

You must verify firmware revision before installing this processor board. The GE IS200BPPBH2B fits exclusively into Mark VI series cabinets. Always replace faulty units with identical GE board revisions. Additionally, check the I/O mapping against your application requirements. This practice prevents configuration conflicts with existing modules.

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